New solution for achieving complex shapes while reducing raw material waste
Slurry conditioned material is casted into product-shaped mold and formed by solidification.
This is Kyocera's new forming method which enables near-net shapes, and is expected to expand ceramics' applications further.
Parts developed via F-Molding have the same or better characteristics compared to those produced by CIP (Cold Isostatic Pressing) forming.
Features
- Unique and Complex Shaped Part FormingAchieves complex designs which can not be achieved by conventional green machining and grinding.
- Near-Net Shape FormingCost savings achieved by reducing material waste with less machining (compared to CIP forming)
- Small Volume Orders AvailableInitial cost saving with less expensive mold (compared to injection molding and press forming)
Design Samples
Material: Zirconia (ZO 206 N) Size: Φ 50 mm
Material: Silicon Nitride (SN 240 O) Size: Φ 50 mm
*Please ask us about available sizes.
Manufacturing Process
Conventional Method
CIP forming +
Green machining
Forming a cylindrical ceramic block
Green Machining into shape
After sintering, final grinding
New Method
F-Molding
Molding into near-net shape
- No green machining process
- ・Reduction of raw material waste
・Reduction of processing time
After firing, final grinding
Material Lineup
| Material Material Code |
Zirconia | Cordierite | Silicon Nitride | ||||
|---|---|---|---|---|---|---|---|
| ZO206N | CO220O | CO720O | SN240O | ||||
| Color | - | White | Gray | Gray | Black | ||
| Density | g/cm3 | 6.0 | 2.50 | 2.54 | 3.3 | ||
| Mechanical Characteristics | Vickers Hardness HV9.807N | GPa | 12.0 | 8.0 | 8.5 | 14.0 | |
| Flexural Strength (3-point Bending) | MPa | 1,100 | 190 | 200 | 1,020 | ||
| Young’s Modulus | GPa | 210 | 140 | 145 | 300 | ||
| Poisson’s Ratio | - | 0.32 | 0.31 | 0.31 | 0.28 | ||
| Fracture Toughness (SEPB) | MPa・m1/2 | 6 | 1-1.5 | 1-1.5 | 7 | ||
| Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-400℃ | × 10-6/K | 10.4 | (*) 1.5 | (*) 1.5 | 2.8 |
| 40-800℃ | 10.8 | (*) 2.1 | (*) 2.1 | 3.3 | |||
| Thermal Conductivity | 20℃ | W/ （m・K） | 3 | 4 | 4 | 27 | |
| Specific Heat Capacity | J/ （g・K） | 0.44 | 0.71 | 0.74 | 0.65 | ||
| Thermal Shock Resistance (quenching into water) |
℃ | 300 | 450 | 400 | 800 | ||
* <|0.05|(23℃)、<|0.02|(22℃)
Materials not listed in the table are under development, please feel free to contact us for further information.
All values listed on this page are representative values obtained from in-house measurements,
and do not constitute guaranteed product specifications.